The relentless march of semiconductor scaling continues to reshape the packaging landscape, driven by Moore’s Law and the ...

Flip chip packaging connects chips directly to boards using solder bumps, skipping the old wire bonding method for a more ...

Smart phones are a rapidly growing share of mobile phone shipments, representing 15% of the market in 2009 and growing to 35% in 2013. Essentially all the growth in mobile phone sales will come from ...

A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via finite element analysis and machine learning” was published by researchers ...

Available in case sizes from 0302 to 0805, the RCX PW Series partial-wrap terminal resistors feature an exposed solder fillet designed to facilitate visual inspection of the terminal joint. The ...