The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

Led by Professor Tony Feng Shien-Ping from the Department of Systems Engineering at CityUHK, the research team developed a novel material to address the complex metallisation challenges in the ...

Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed at assisting companies ...

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is ...

SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park. The ...

Arizona State University-affiliated research programs and laboratories will receive $1.2 billion in new funding for semiconductor packaging, winning two of four new national awards announced by the ...

Touch panel maker TPK is partnering with semiconductor packaging giant ASE to enter the advanced through-glass via (TGV) ...

Amkor Technology Inc.'s plans to build a $2-billion semiconductor advanced packaging manufacturing plant in Peoria, Ariz., are advancing with support from the U.S. Dept. of Commerce. The Tempe, ...

As trade tensions reshape global alliances and channel partnerships, the chip industry’s resilience faces an unprecedented ...